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* Home > Capabilities > Electronics > INTEGRAMplus > Smart Silicon MEMS Prototyping and Manufacture *
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Smart Silicon MEMS Prototyping and Manufacture

Use INTEGRAMplus for the development and commercialisation of discrete or integrated microsystems for physical sensing, actuation, microfluidic and optical applications.
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Smart Silicon MEMS Prototyping and Manufacture Choose from cost-efficient multi-project wafer (MPW) runs and more flexible single-project wafer (SPW) services for discrete MEMS. For more specialised requirements (including monolithic integration), a full custom service is available. This is based on custom sequences of standard steps where possible to reduce cost.

Select from 3 core MEMS process technologies:
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  • Polysilicon surface micromachining (PPK).
  • Metal-nitride surface micromachining (MPK) (CMOS compatible).
  • DRIE (Deep Reactive Ion Etch) - based high aspect ratio micromachining of SOI (silicon on insulator).

The SOI DRIE process enables high aspect ratio structures and employs a thicker structural layer (10-100μm) than the surface micromachining processes (0.3-3μm). Each process is supported by a design handbook containing information to enable a designer to simulate and design devices. This has already been encoded into CAD support files for L-Edit™ and CoventorWare™.
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Smart Silicon MEMS Prototyping and Manufacture Use INTEGRAMplus for access to MEMS foundry manufacturing in a state-of-the-art 6 inch wafer fab. Optional through-wafer via technology offers a low-cost solution for wafer-level packaging and surface mount assembly allowing electrical connections from the front to the back surface of a wafer.
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