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* Home > Capabilities > Electronics > MEMS > MEMS Services *
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MEMS Services

Micromachining
Our leading edge micromachining capability offers precise, reliable, deep etched structures, using;

  • High-rate (ASEHRM) cluster and multiplex STS tools
  • 100, 125 and 150mm wafer sizes
  • Bulk silicon and silicon-on-insulator (SOI) wafers
  • Etch depths 1 micron to 500 micron (through wafer)
  • Feature sizes 2 micron to several mm, aspect ratios of up to 30:1
  • Standard process recipes or customisation
  • Flexible number of wafers


We have successfully demonstrated the ability to design and develop customised micromachining processes, application specific MST prototype devices and subsystems that combine integrated electronics with microsensors.
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Chemical Vapour Deposition Chemical Vapour Deposition
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Chemical Vapour Deposition
QinetiQ has extensive Chemical Vapour Deposition (CVD) facilities and expertise to deposit materials on to silicon, ceramics and other substrates to give added functionality in devices and microsystems e.g. MEMS. These range in complexity from simple layers for interconnection and electrodes, through simple device structures on a range of substrates, to complex materials and structures to add functionality to silicon circuits for sensing and actuation applications.

Our advanced equipment gives precise control of materials deposited with excellent reproducibility. In addition to single layers the technique is well suited to the deposition of multilayer structures and layers with complex graded compositions. Our CVD technology is flexible, giving minimal setting up time, with a very fast turn-round of samples.
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Advanced Analytics Advanced Analytics
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Advanced Analytics
Our comprehensive range of Advanced Analytical techniques provides a responsive materials analysis service, to aid process quality assurance, defect review and rapid problem solving. We offer a comprehensive range of techniques for the analysis of materials and devices. Our direct experience and expertise spans electronic, optical, optoelectronic and photonic materials, processes and devices, as well as metals, surface coatings, ceramics, polymers, biomaterials, nanomaterials and environmental analysis.
Major capabilities include:


  • Secondary ion mass spectrometry (2 Cameca SIMS)
  • High resolution transmission electron microscopy (HRTEM)
  • Scanning electron microscopy (SEM instruments with field emission and X-ray microanalysis)
  • High- and low- resolution X-ray diffractometry
  • Single-crystal and double-crystal X-ray topography
  • Atomic force microscopy (AFM)
  • Advanced optical techniques (scanning optical microscope, Wyko interferometric microscope, spectroscopic ellipsometry (SE), FTIR and Raman spectroscopy)
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Engineering Solutions Engineering Solutions
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Engineering Solutions
Our vast range of capabilities and experience in all aspects of design engineering ensures a versatile and flexible approach to solving real problems, and with a proven rapid response record we repeatedly uphold our commitment to provide timely and effective engineering solutions to your needs.
Our engineering capability turns your concepts in to reality. TEST US.


  • Electronic sub-system design; Printed Circuit Board (PCB) / Multi Chip Module (MCM) / Complementary Metal Oxide Semiconductor (CMOS) devices.
  • Highly experienced mechanical design engineers and technicians
  • Rapid Prototyping Stereo Lithography
  • 3D Virtual Reality Models, on screen, PC based presentations or space models
  • Computer aided manufacture
  • Wide range of mechanical machining capabilities
  • Metrology
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